PRODUCT DESCRIPTION

TYPICAL PROPERTIES OFUNCURED MATERIAL

TYPICAL CURINGPERFORMANCE

Surface Cure

Cure Speed

The graph below shows shear strength developed with timeonAluminum lapshears at a bond gap of 0.5 mm. Curecondition 23±2 °C, 60±5% RH.Strength is determinedaccording to ISO 4587.

Depth of Cure

The depth of cure depends on temperature and humidity.Depth ofcure was measured on strip pulled from aramped PTFE mold (maximum depth 10mm).The graph below shows the increase in depth of cure withtime at 23±2 °C / 50±5 % RH.

TYPICAL PROPERTIES OFCURED MATERIAL

Cured for 1 week @ 25 °C / 50±5 % RH

GENERAL INFORMATION

This product is not recommended for use in pure oxygenand/oroxygen rich systems and should not be selected asa sealant for chlorine orother strong oxidizing materials.For safe handling information on this product,consult the Safety Data Sheet (SDS).

Directions for use

1. For best performance bond surfaces should be clean andfree fromgrease.

2. Moisture curing begins immediately after the product isexposed to theatmosphere, therefore parts to beassembled should be mated within a few minutesafter theproduct is dispensed.

3. The bond should be allowed to cure (e.g. seven days),beforesubjecting to heavy service loads.

4. Excess material can be easily wiped away withnon-polarsolvents.

5. For full automatic applications a volumetric dispensingsystemis recommended.